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Nanofabrication and Clean-Room

Shared facilities operated by the Nebraska Center for Materials and Nanoscience (NCMN). The facility provides state-of-the-art instruments for designing, fabricating, characterizing and testing of complex nano/micro-scale structures and devices.  All these advanced tool sets are housed within the 4000 sq. ft. clean room at the Voelte-Keegan Nanoscience Research Center. The facility opens to all UNL researchers as well as external (including private sector) researchers for carrying out their research projects in physics, chemistry, nano/microelectronics, MEMs/NEMs, nano-bio, and other related and interdisciplinary areas.  Staff support is available for training, process consultation, and collaboration on new process development.

Major Instruments
- Electron Beam Lithography System (EBL)
- Laser Lithography System (DWL66 -FS)
- Mask Aligner (MJB-4)
Focused Ion Beam
- FEI Strata 200xp Focused-Ion Beam (FIB) Workstation
- Reactive Ion Etching System (Trion Minilock-Phantom III)
- Oxford PlasmaPro 100 Deep RIE System
- Intlvac Nanoquest-I Ion Beam Etching and Milling System
- AJA ATC-ORION 8000 E-beam Evaporation System

- Stylus Profilometer (Dektak-XT)


Facility Type: 


  1. AJA ATC-ORION 8000 E-beam Evaporation System

    The AJA ATC-ORION 8000 E-beam evaporator is a performance UHV thin film deposition system. The system contains four material pockets for deposition of single and multi-layer films without breaking vacuum. The substrate holder can handle substrates up to 4 inches in diameter and allow simultaneous rotation. It also can be heated up to 850 °C in suitable environment. A load-lock chamber allows quick removal and insertion of samples without venting the chamber.

  2. Electron Beam Lithography System (EBL)

    This EBL system is composed with a Zeiss Supra 40 field-emission scanning electron microscope and a Raith pattern generator. The Zeiss Supra 40 features electron beam up to 30KeV and provides capability of reproducibly achieving feature sizes as small as 20nm. It is also integrated with an laser interferometer-controlled wafer stage, which makes it possible to accomplish stitching application and multilayer EBL with overlay accuracy better than 50nm on a wide variety of substrates. Equipment Specification:

  3. FEI Strata 200xp Focused-Ion Beam Workstation

    Featuring FEI's 30 kV focused Ga+ ion column, this focused ion beam (FIB) system is a versatile tool for performing work at the nanoscale. The most powerful capability of FIB is precisely controlled milling, which allows the freedom to manipulate the sample such as create a cross-section, remove material from selected region or create any possible shape in various substrates and materials as "carved in stone".

  4. Intlvac Nanoquest-I Ion Beam Etching and Milling System

    This is a versatile R&D ion beam development platform for both thin film milling and deposition.  It works on almost all known solid materials.  It also includes eight magnetron sputtering guns for magnetic material disposition and a Secondary Ion Mass Spectrometry (SIMS) probe subsystem for precise etch.  The “SIMS” probe allows users to define etch end point and mount of over etch provides the required levels of sensitivity of end point detection.