The system contains 4 magnetron sputtering guns (2 DC and 2 RF) which allow in-situ tilting of their heads without breaking vacuum. This permits the user to optimize either uniformity or rate at any working distance in a very short amount of time without venting, resetting the angle, pump down and test. The system can handle substrates up to 4 inches in diameter and the substrate holder will allow simultaneous rotation, heating, RF bias and deposition at up to 850 °C in suitable sputtering environment (600 °C in a pure Oxygen environment). A load-lock chamber and cassette allows the samples to be removed and changed without venting the chamber. The cassette can hold up to 6 substrates holders.