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Home
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Synthesis and Fabrication (239)
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Thin Film Processing and Deposition (134)
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Microfabrication / Microelectronics / Clean Room (71)
Wire Bonding
Instrument
Flip Chip Bonder
@
Shared Materials Instrumentation Facility (SMIF)
@
Research Triangle MRSEC
Kulicke & Soffa 4523 Wire Bonder
@
Fabrication and Processing
@
Materials Research Science Engineering Center
Kulicke & Soffa 4526 Wire Bonder
@
Materials Preparation and Measurement Laboratory (MPML)
@
Chicago Materials Research Center
Wedge Bonder
@
Central Facility for Microelectronics
@
Center for Advanced Materials Research
West Bond SZ51 Wire Bonder
@
NanoSystems Laboratory (NSL)
@
Center for Emergent Materials
Wire Bonders
@
Materials Cluster
@
Cornell Center for Materials Research
People
Jerry Hunter
@
Wisconsin MRSEC
News
Shared instrumentation facilities: Benefiting researchers and universities, and sustaining research excellence
Making the Best of a Bad Situation: A Characterization Seminar Series
How NSF's Materials Research Facilities Network helps bolster the field of materials science and engineering
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